Home / Knowledge / News / Information Technology / IMEC reports ultra-thin chip embedding for wearable electronics
IMEC reports ultra-thin chip embedding for wearable electronics
13
Mar '09
At Smart Systems Integration Conference in Brussels (Belgium), technologists from IMEC and its associated laboratory at Ghent University present a new 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometer. This ultra-thin chip package (UTCP) technology allows integrating complete systems in a conventional low-cost flex substrate. This paves the way to low-cost, unobtrusive wearable electronics for e.g. wearable health and comfort monitoring.

For the integration, the chip is first thinned down to 25 micron and embedded in a flexible ultra-thin chip package. Next, the package is embedded in a standard double-layer flex printed circuit board (PCB) using standard flex PCB production techniques. After embedding, other components can be mounted above and below the embedded chip, leading to a high-density integration.

The integration process uses UTCP interposers which solve the “Known Good Die” issue by enabling easy testing of the packaged thin dies before embedding. Expensive high-density flexible substrates can be avoided by the fan-out UTCP technology which relaxes the interconnection pitch from 100µm or lower to 300µm or more, compatible with standard flex substrates.

IMEC demonstrates the integration technology with a prototype flexible wireless monitor that measures the heart rate (electrocardiogram or ECG) and muscle activity (electromyogram or EMG). The system consists of an embedded ultra-thin chip for the microcontroller and analog-to-digital convertor, an ultra-low power biopotential amplifier chip and a radio transceiver. By thinning down the chips for UTCP embedding, they become mechanically flexible resulting in an increased flexibility of the complete system, making it unobtrusive and comfortable to wear.

IMEC

Must ReadView All

Textiles | On 29th Apr 2017

Textile sector may have uniform GST rate: Irani

The textile sector could have a uniform Goods and Services Tax (GST)...

Textiles | On 30th Apr 2017

Government revamping tech mission on cotton

Indian Government is working to revamp the technology mission on...

Apparel/Garments | On 30th Apr 2017

Columbia Sportswear records Q1 net sales of $543.8 mn

Columbia Sportswear Company has announced record net sales of $543.8...

Interviews View All

Amit Jain
Shingora Textiles Ltd

‘In terms of fabric, the fastest growing category for us is a blend of...

Nuno Venda
ROQ

‘There has been an increase in demand for water based inks, rather than...

Vasanth Kumar
Max Fashion India

‘Traditional high-street retailers are now willing to offer franchisees to ...

Urs Stalder
Sanitized AG

Urs Stalder, CEO, Sanitized AG, talks about the increasing use of hygiene...

Giorgio Mantovani
Corman S.p.A

Giorgio Mantovani, MD of Corman, with a presence in both Milano and New...

Marcel Alberts
Eurofibers

Coating at a fibre level is a practice not usually seen in the...

Rupa Sood and Sharan Apparao
Nayaab

Nayaab, an exhibition meant to celebrate Indian weaves, is in its second...

Tony Ward
Tony Ward

"You have to truly understand what your client wants, know her needs, what ...

Yash P. Kotak
Bombay Hemp Company

One of the directors of Bombay Hemp Company, Yash P. Kotak, speaks to...

Press Release

Press Release

Letter to Editor

Letter to Editor

RSS Feed

RSS Feed

Submit your press release on


editorial@fibre2fashion.com

Letter To Editor






(Max. 8000 char.)

Search Companies





SEARCH

news category


Related Categories:
April 2017

April 2017

Subscribe today and get the latest update on Textiles, Fashion, Apparel and so on.

SUBSCRIBE


Browse Our Archives

GO


E-News Insight
Subscribe Today and Get the
Latest News Update in Your Mail Box.
Advanced Search



X