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Solvay debuts high stiffness grade polymer KetaSpire PEEK

26 May '14
4 min read

As an added bonus, KT-825 achieves a 70% higher dielectric strength relative to neat PEEK. Dielectric strength per ASTM D149 at a thickness of 3.2 mm (0.13 in) is 26.0 kV/mm (660 V/mil) for KT-825 as compared with 15.2 kV/mm (385 V/mil) for neat PEEK. This makes KT-825 particularly suited for applications where a combination of high mechanical properties and a high degree of electrical insulation is needed.

The new compound can be processed by conventional methods including injection molding and extrusion. It also has excellent film forming characteristics for melt extruded films down to thicknesses of approximately 50 microns (0.05 mm). Targeted application areas include automotive and aerospace due to a continuing demand for materials that offer a high stiffness-to-weight ratio as well as structural applications in mobile electronics where a good balance of stiffness and toughness are required along with a low specific gravity.
 
Initially, the natural grade KT-825 NT is being made available; however, black and other colors are available upon request. The semi-commercial product is available for sampling and pilot-scale production.
 

Solvay Specialty Polymers

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