Home / Knowledge / News / Apparel/Garments / Bemis showing Sewfree Bonding solutions at ISPO Munich
Bemis showing Sewfree Bonding solutions at ISPO Munich
07
Feb '17
Courtesy: Bemis Associates
Courtesy: Bemis Associates
Supplier of bonding technologies, Bemis Associates is participating at ISPO Munich and will be displaying its complete range of Sewfree Bonding solutions. Bemis will also show more solutions, which range from technical applications to integrated garments and technology from leading partners like Cotton Inc., Woolmark, Under Armour and Noble Biomaterials.

Bemis will also be showcasing new products including Nylock and Terra Collection. Nylock provides designers with an unprecedented bonding solution for tightly woven, lightweight fabrics and smooth finishes for both construction and aesthetics.

Engineered for maximum performance while minimising garment weight and maintaining breathability, the Terra Collection can be applied to natural fibres like cotton, fleece and wool, thereby opening a new area of design possibilities.

Bemis has leveraged its Sewfree technology in collaboration with Noble Biomaterials to develop a fully bonded kit that allows for the infusion of active devices such as biometric sensors, lights, and power into apparel, which can also be seen at its booth. (AR)

Fibre2Fashion News Desk – India


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